About
The ongoing miniaturization of medical devices is placing fundamentally new demands on printed circuit board technology. Implantable systems, wearable biosensors, and minimally invasive diagnostic devices require solutions that go well beyond the current state of conventional electronics manufacturing. This presentation highlights recent developments and future trends in PCB technology, with a particular focus on three core challenges: miniaturization, biocompatibility, and long-term reliability.
In the area of miniaturization, approaches for high-density interconnect structures on flexible and rigid-flex PCB concepts are discussed, enabling three-dimensional integration within extremely confined spaces. In addition, developments in ultra-thin substrates and the convergence with wafer-level packaging technologies are presented.
A further focus is placed on the biocompatibility of PCB materials and surface finishes. Biocompatible base materials and electrode materials are examined that ensure safe application in body-adjacent and implantable environments while complying with the relevant standards.
Finally, strategies for ensuring long-term reliability under physiological conditions are addressed. Topics covered include accelerated aging tests, moisture-resistant material concepts, and the effects of mechanical stress caused by body movement on flexible circuit carriers.
The presentation is aimed at developers, manufacturing engineers, and product managers who are engaged with the ever-growing demands placed on electronic assemblies in medical technology, and provides a practice-oriented overview of the current state of the art as well as promising development pathways for the future.
In the area of miniaturization, approaches for high-density interconnect structures on flexible and rigid-flex PCB concepts are discussed, enabling three-dimensional integration within extremely confined spaces. In addition, developments in ultra-thin substrates and the convergence with wafer-level packaging technologies are presented.
A further focus is placed on the biocompatibility of PCB materials and surface finishes. Biocompatible base materials and electrode materials are examined that ensure safe application in body-adjacent and implantable environments while complying with the relevant standards.
Finally, strategies for ensuring long-term reliability under physiological conditions are addressed. Topics covered include accelerated aging tests, moisture-resistant material concepts, and the effects of mechanical stress caused by body movement on flexible circuit carriers.
The presentation is aimed at developers, manufacturing engineers, and product managers who are engaged with the ever-growing demands placed on electronic assemblies in medical technology, and provides a practice-oriented overview of the current state of the art as well as promising development pathways for the future.
Speakers
